Infineon today announced the launch ofthe world’s thinnest silicon power waferbecoming the first company to master20um ultra-thin power semiconductorwafer processing and processingtechnology. The diameter of the wafer is30mm and the thickness of 20um is onlya quarter of the thickness of a humanhair, which is half the thickness of thecurrent state-of-the-art 40-60um wafer.The technology has been recognized andused in Infineon’s integrated smart powe!stages(DC-DC converters) and has beendelivered to the first customers
